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product structure : silicon monolithic integrated circuit this product is not designed to have protection against radioactive rays. 1/14 tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 11.apr.2016 rev.004 single-output ldo regulators 30v voltage resistance 0.1a ldo regulators bdxxfa1fp3 series general description bdxxfa1fp3 series are ldo regulators with output current capa bility of 0.1a. the output vo ltages are 3.3v, 5.0v, 5.4v, and 12.0v with 1% accuracy. the sot89-3k package is most su itable for heat dissipation. as protective function to prevent ic from destruction, this chip has built-in over current protection circuit to protect the device when output is shorte d, and built-in thermal shutdown circuit to protect the ic during thermal over load conditions. this product can be used in wide variety of digital appliances. these regulators can use ce ramic capacitor, which have smaller size and longer life than other capacitors. features ? high accuracy output voltage 1.0% ? built-in over current protection circuit (ocp) ? built-in temperature protection circuit (tsd) ? soft start function key features ? input power supply voltage range: vo+3.0v to 25.0v ? output voltage: 3.3v, 5.0v, 5.4v, 12.0v ? output current: 0.1a (max) ? operating temperature r ange: ta= -25c to +85c typical application circuit package w(typ) d(typ) h(max) sot89-3k 4.50mm x 4.095mm x 1.60mm ordering information b d x x f a 1 f p 3 - z t l part number output voltage 33: 3.3v 50: 5.0v 54: 5.4v j2: 12v input voltage f:30v output current a1:0.1a package fp3:sot89-3k manufacturing code packaging and forming specification tl : emboss tape reel v o v cc gnd fin c out c in c in ,c out : ceramic capacitor downloaded from: http:///
2/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 block diagram pin configuration pin description pin no. pin name pin function 1 vo output pin 2 gnd gnd pin 3 vcc input pin reverse fin gnd (connected to 2pin) gnd tsd ocp soft start v o v cc figure. 1 block diagram 1 v o v cc 2 3 gnd (top view) sot89-3k fin reverse downloaded from: http:///
3/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 absolute maximum ratings (ta=25c) parameter symbol limits unit power supply voltage v cc -0.3 to +30.0 * 1 v output voltage vo -0.3 to +18 v power dissipation sot89-3k pd* 2 1.67 * 2 w operating temperature range ta -25 to +85 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax +150 c *1 not to exceed pd. *2 in case ta R 25c (114.3mm 76.2mm 1.6mm when mounted on a 4-layer pcb based on jedec) is reduced by 13.4mw/c recommended operating conditions (ta=25c) parameter symbol min. max. unit input power supply voltage v cc vo+3.0 25.0 v output current i o 0.0 0.1 a recommended operating condition parameter symbol min typ max unit conditions output capacitor c out 0.3 * 3 1.0 - f ceramic capacitor recommended *3 the minimum value of capacitor must met this specificatio n over full operating conditions. (ex: temperature, dc bias) electrical characteristics (unless otherwise specified, vcc= vo+5v, ta=25c) parameter symbol limits unit conditions min. typ. max. bias current i cc - 300 450 a i o =0a, vo=3.3v - 300 450 a i o =0a, vo=5.0v - 300 450 a i o =0a, vo=5.4v - 400 600 a i o =0a, vo=12.0v line regulation reg.i -1 0.5 1 % v cc =( vo+3v ) 25.0v load regulation reg i o -1.5 0.5 1.5 % i o =0 0.1a minimum dropout voltage v co - 1.0 3.0 v i o =0.1a output voltage v o vo 0.99 vo vo 1.01 v i o =0a downloaded from: http:///
4/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 o vge v [v] y vge v [v] 0 1 2 3 4 5 6 7 8 9 10 0 102030405060708090100 io ? 5 0ma/ div vo 50mv / div 100us/div 0 1 2 3 4 5 6 7 8 0 1002003004005006007008009001000 100us/div vo 2v/div vcc 5v/div 0 1 2 3 4 5 6 7 8 9 10 0 102030405060708090100 1us/div io ? 5 0ma/ div vo 50mv / div performance curve (reference data) bd54fa1fp3 (unless otherwise specified, ta=25c, vcc=vo+5v, c in =c out =1 f) figure 2. vcc - vo figure 3. input sequence (c out = 1 f) figure 4. transient response (io = 0a 0.1a) (c out = 1 f) figure 5. transient response (io = 0.1a 0a) (c out = 1 f) 100 s/div 1 s/div 1 s/div 100 s/div 0v 0v 5.4v 0ma 0ma 5.4v downloaded from: http:///
5/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 o vge v [v] teee t [] i e i [ ] teee t [] i e i [ ] o e i [] o vge v [v] o e i [] performance curve (reference data) bd54fa1fp3 (unless otherwise specified, ta=25c, vcc=vo+5v, c in =c out =1 f) figure 6. ta - vo ( io = 0ma ) figure 9. io - vo figure 8. io - icc figure 7. ta - icc downloaded from: http:///
6/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 o vge v [v] ie teee t [] performance curve (reference data) bd54fa1fp3 (unless otherwise specified, ta=25c, vcc=vo+5v, c in =c out =1 f) figure 11. tsd (io = 0ma) figure 13. psrr (io = 50ma) figure 12. ocp figure 10. minimum dropout voltage 0 0.2 0.4 0.6 0.8 1 1.2 dropout voltage: vco [v] output current: io [m a] downloaded from: http:///
7/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 o e i [] eie eie eie e [] performance curve (reference data) bd54fa1fp3 (unless otherwise specified, ta=25c, vcc=10.4v, c in =c out =1 f) figure 14. esr stable region stable area downloaded from: http:///
8/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 power dissipation sot89-3k 0 0.5 1 1.5 2 0 2 55 07 51 0 01 2 51 5 0 power ? dissipation: ? pd ? [w] ambient ? temparature: ? ta ? [ ] j-a = 74.8 /w measurement condition: mounted on 4-layer jedec standard board board size: 114.3mm 76.2mm 1.6mm when considering thermal design, operation should be maintained within the following conditions. (the temperature mentioned below is a guaranteed temperature, therefore, margins must be considered.) 1. ambient temperature ta is 85c and below. 2. junction temperature tj is 150c and below. the junction temperature tj can be determined as follows: calculation based on ambient temperature ta tj=ta+ j-a w ? j-a: sot89-3k 74.8c/w jedec standard 4 layers pcb board size: 114.3mm 76.2mm 1.6mm most of the heat loss that oc curs in bdxxfa1fp3 is generated from the out put pch fet. power loss is determined by the product of voltage drop across vcc-vo and the output current. c heck the conditions of output vo ltage and output current to be used between vcc-vo and compare with the power dissipation characteristics. in addition, power dissipation may change significantly due to board conditions because bdxxfa1fp3 uses power package. it is important to consider the board size to be used before proceeding with the design. power consumption [w] = { input voltage (vcc) C output voltage (vo) } output current (io: ave) example) vcc = 10.4v, vo = 5.4v, io(average) = 0.1a power consumption [w] = ( 10.4v C 5.4v ) 0.1a = 0.5w j-a = 74.8c/w downloaded from: http:///
9/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 0.01 0.1 1 10 0 2 04 06 08 01 0 0 equivalent ? series ? resistance: ? esr ? [ ] output ? current: ? io ? [ma] I input/output capacitor it is recommended that a capacitor is placed close to pin be tween input pin and gnd as well as output pin and gnd. the input capacitor becomes more necessary when the power suppl y impedance is high or when the pcb trace has significant length. moreover, the higher the capacit ance of the output capacitor the more stabl e the output will be, even with load and line voltage variations. however, please check the actual f unctionality by mounting on a boar d for the actual application. also, ceramic capacitors usuall y have different thermal and equivalent series resistance characteristics and may degrade gradually over continued use. for additional details, please check with the manufacturer and select the best ceramic capacitor for your application. output capacitor equivalent series resistance to prevent oscillation, please attach a capacitor between v o and gnd. generally, capacitor has esr (equivalent series resistance). operation will be stable in esr-io range *1 shown in the right. the 1.0f ceramic capacitor and resistor at output in this characteristic data are connec ted in series and measured. generally, esr of ceramic capacitor, tantalum capacitor and electrolytic capacitor is different. check the esr of capacitor to be used and use it within the range of stable region. however, please take note that for the same value of capacitance of different electrolytic capacitor, esr are not always the same. in addition, esr characteristics may also change due to wiring impedance of board, input power impedance and load impedance; therefore check the behavior in actual application. *1 ta=25c, vcc=6.3v to 25v, io=0a to 0.1a stable area dc bias voltage [v] ceramic capacitor capacitance value - dc bias characteristics ( characteristics exam p le ) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 01234 rated voltage: 10v b1 characteristics grm188b11a105ka61d rated voltage: 10v b characteristics rated volta g e: 6.3v b characteristics rated voltage: 4v x6s characteristics rated voltage: 10v f characteristics capacitance change [%] downloaded from: http:///
10/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 input/output equivalent circuit 3pin (v cc ) 1pin (v o ) 3pin (v cc ) / 1pin (v o ) downloaded from: http:///
11/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 operational notes (1) absolute maxi mum value rate operating the ic over the abs olute maximum ratings may damage the ic. in addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. (2) reverse connection of power supply connecting the power supply in reverse polarity can dam age the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. (3) power supply line design the pcb layout pattern to provide low impedance ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the gr ound and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at a ll power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (4) ground voltage the voltage of the ground pin must be the lo west voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (5) thermal consideration use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. (6) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are sh orted together. short circuit may be caused be c onductive particles caught between the pins. (7) operation under str ong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. (8) thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit, which is designed to turn off the ic when the internal temperature of the ic reaches a specified value. it is not designed to protect the ic fr om damage or guarantee it s operation. do not continue to operate the ic after this functi on is activated. do not use the ic in co nditions where this function will always be activated. (9) testing on application boards when testing the ic on an application boar d, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removi ng it from the test setup duri ng the inspection process. to prevent damage from electro static di scharge, ground the ic during assembly and use similar precautions during transport and storage. tsd on temperature [c] (typ) hysteresis temperat ure [c] (typ) bdxxfa1fp3 173 8 downloaded from: http:///
12/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 (10) regarding input pins of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjace nt elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. (11) ground wiring pattern when using both small-signal and large- current gnd traces, the two ground tr aces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluc tuations in the small-signal ground caused by large currents. also ens ure that the gnd traces of external components do not cause variations on the gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. downloaded from: http:///
13/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 external measurement drawing and packing forming specification package name sot89-3k downloaded from: http:///
14/14 bdxxfa1fp3 datasheet tsz02201-0g2g0a600060-1-2 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 11.apr.2016 rev.004 marking diagram revision history output voltage [v] part number marking(xx) 3.3 33 5.0 50 5.4 54 12.0 j2 date revision re vision contents 2014.02.04 001 new release 2014.10.31 002 added 5.0v and 12v to output voltage line-up. 2015.06.08 003 the document control number: tsz02201-0r6r0a600600-1-2 tsz02201-0gag0a600600-1-2. modified the package name to sot89-3k. modified external measurement drawing. 2016.04.11 004 p.1 ordering information changed p.3 electrical characteristics added p.6 figure 13. psrr modified from (io=0ma) to (io=50ma) the document control number: tsz02201-0r6r0a600600-1-2 tsz02201-0g2g0a600060-1-2 part number marking lot number 1pin sot89-3k (top view) x x f 1 downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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